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RH150

主營(yíng)生產(chǎn)通訊設(shè)備、數(shù)碼家電、電腦等產(chǎn)品之主要電子基礎(chǔ)材料：銅箔基板，提供給客戶滿意的產(chǎn)品選擇與售后服務(wù)。

所屬分類：

無(wú)鹵兼容FR-4

產(chǎn)品關(guān)鍵詞：

手機(jī)

電子產(chǎn)品

筆記本電腦

關(guān)鍵詞：

普通FR-4 | 半固化片 | 無(wú)鉛兼容FR-4 | 無(wú)鹵兼容FR-4

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產(chǎn)品描述

電子資訊工業(yè)近幾年來(lái)在中國(guó)的迅速發(fā)展下，結(jié)合各種相關(guān)產(chǎn)業(yè)，已經(jīng)成為中國(guó)蓬勃發(fā)展、舉足輕重的新興產(chǎn)業(yè)。
江蘇諾德正是藉此信息產(chǎn)業(yè)化發(fā)展之平臺(tái)，以專業(yè)制造電子基礎(chǔ)材料為優(yōu)勢(shì)，于2007年開(kāi)始建立銅箔基板生產(chǎn)基地，憑借優(yōu)秀的科技人才與創(chuàng)新的研發(fā)能力，配套發(fā)展生產(chǎn)通訊設(shè)備、數(shù)碼家電、電腦等產(chǎn)品之主要電子基礎(chǔ)材料：銅箔基板，提供給客戶滿意的產(chǎn)品選擇與售后服務(wù)。

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RH150

(UL ANSI:FR-4.1)High Performance，Mid-Tg Halogen-free

特點(diǎn) 不含鹵素、砷、紅磷等成份優(yōu)良的機(jī)械加工性能和熱性能，適用于無(wú)鉛工藝		*應(yīng)用領(lǐng)域* 手機(jī)、便攜式電子產(chǎn)品、筆記本電腦、檢測(cè)設(shè)備、通信、網(wǎng)絡(luò)設(shè)備

*FEATURES* Free of constituents such as halogen，animony，red phosphorous，ect。 Excellent mechanical processibility and thermal resistance，lead free process compliancy。		*APPLICATIONS* Mobile phone，portable electronics，notebook and PC， QA equipment， communications，network equipment

*GENERAL PROPERTIES*
Test Item	Test condition		Units	Standard value	Typical value
1.Peel Strength , IBS/IN,Minimum,1 OZ			IBS/IN
As received	A			≥8.0	10.8
After thermal stress	A			≥8.0	10.8
2. Volume resistivity ,Minimum At elevated temperature E-24/125	E-24/125		MΩ.cm	≥103	≥107
3. Surface resistivity , Minimum At elevated temperature E-24/125	E-24/125		MΩ	≥103	≥107
4.Water absorption , Maximum	E-1/105+des		%	≤0.50	0.15
5.Dielectric Breakdown, Minimum	D-48/50 D-0.5/23		Kv	≥40	43
6. Flexural strength ,Minimum			Mpa
Length direction	A			≥415	580
Cross direction	A			≥345	460
7.Arc resistance ,Minimum	D-48/50 D-0.5/23		S	≥60	160
8.Flammability	A		S	UL-94V0	UL-94V0
9. Permittivity 1MHZ ,Maximum	A			≤5.4	4.8
10.Loss tangent 1MHZ ,Maximum	A		---	≤0.035	0.011
11.Thermal stress 288℃,10sec( Minimum )			---
Non etched specimen	A			NO DEFECT	NO DEFECT
Etched	A			NO DEFECT	NO DEFECT
12. TG(DSC,℃)	A		℃	≥150	152
13.CTE(Z-axis)	Before Tg		PPM/℃	≤60	45
	After Tg		PPM/℃	≤300	240
	50-260℃		%	≤3.5	2.9
14.T260	TMA		min	≥30	60
Note: the treatment of letters and numerical meaning A - plate delivery stage D - constant temperature water bath E - high temperature baking number 1 / number 2:1 - time (hours) 2 - temperature ( ℃) des - drying 10 minutes or more or drying condition cooling to room temperature.

Warpage of Warpage of

(No-treating) (After treating:125℃ 2hr)

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　　 Peel strength

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　　※Specimen T hickness:1.6mm single side board

PURCHASING INFORMATION
Thickness	Copper foil	Standard Size
0.2mm to 3.4mm	12μm to 105μm	1041×1245mm（41″×49″） 940×1245mm（37″×49″） 1092×1245mm（43″×49″）
※ Other sheet size and thickness could be available upon request.

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